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Polyimide Film can be used at both high and low temperatures where other organic material would not be functional. The ability of Polyimide Film to maintain its excellent physical, electrical, and mechanical properties over a wide temperature range has opened new design and application areas to plastic films. It is flame resistant and there is no known solvent for the film. It can be laminated, metalized, punched, formed, or adhesive coated. Polyimide Film is available in several formulations, including Teflon coated, which improves its chemical resistance, and heat sealability.

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Excellent dielectric strength
Wide temperature range
Excellent dielectric dissipation factor
Radiation resistance at elevated temperatures
Chemical resistance at elevated temperatures
Flame resistant

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